Brazing & Soldering

Mat-tech is made of two departments: Mat-tech Production and Mat-tech Development & Testing (DT).  Mat-tech, besides other joining technologies, offers the following brazing and soldering processes:

      • Vacuum Brazing
      • Induction Brazing
      • Diffusion Bonding
      • Metal-Ceramics Brazing
      • Aluminum Brazing / Soldering
      • Fluxless Soldering

Solder joints have a number of important advantages:

      • They provide good thermal and electrical conductivity
      • A very high joint strength is possible (extra high when increasing the joining area)
      • Gaps can be filled (capillary action)
      • No line of sight is required, as with welding techniques
      • It is suitable for any production scale (single pieces to mass)
      • It is well reproducible
      • The combination with heat treatment is possible
      • Thick-thin joining are no problem
      • It is possible to join different materials

COVID-19

The Coronavirus (COVID-19) is still having an effect on everyone and of course you would like to know what we do to ensure the continuity of our services. Mat-tech has implemented measures at all its locations (two in the Netherlands and one in the UK).

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Vacuum Brazing

Vacuum brazing is the joining of materials using a filler material to be melted in a vacuum furnace. This can be a metal-metal joint, but also joining of metal to ceramic or even of ceramic to ceramic. The joints are relatively strong and have properties such as good heat and electrical conductivity.

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Engineering

Mat-tech investigates, develops and produces soldered joints in engineering products. Improving an existing product, reducing the failure or, for example, increasing the strength. We have a wealth of experience and knowledge with joining materials such as titanium, aluminum, stainless steel, copper, ceramics and other many other materials.

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Electronics

Mat-tech investigates and develops solder joints in electronics, among other things. Themes such as lead-free soldering, optimization of soldering processes, choice of solder material, failure analysis, functional and material technical tests are regularly discussed.

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